The difference between ceramic bond and resin bond
Ceramic bond diamond grinding tool creates high grinding accuracy and efficiency, low grinding temperature, long lifespan, and resistant to acid, alkali and corrosion, has good self-sharpening etc, widely applied in the field of modern material processing, especially hard brittle materials processing industry. There are some remarkable features for ceramics : (1) the self-made HO bond, its melting point is 650 ℃, has wide range sintering; (2) the maximum flexural strength is 90.08 MPa, when the sintering temperature of ceramic bond diamond grinding tool at 735 ℃ (3) determination of the sintering process of the sintering of HO ceramic bonded diamond grinding tools; (4) the diamond grinding tool of HO ceramic bond is burned to produce the microcrystalline phase lithium pyrolite (LiAlSi2O6), which improves the strength of the abrasive.
Diamond grit 140/170 ceramic bond grinding tool grinds hard alloy (YG8), the surface roughness is 0.5μm~0.9μm, and the roughness is 0.1μm~0.3μm after grit 270/325 ceramic bond tool grinding. The grinding efficiency is higher, but poor surface finishing, comparing with same grit resin bond grinding wheel.
Ceramic grinding tools have the following advantages comparing to resin grinding: (1) high grinding efficiency of ceramic grinding wheel; (2) for ceramic grinding wheel, it can adopt a large amount of feed, and the resin grinding wheel will not grind when the feed quantity exceeds a certain number. (3) it is hardly necessary to trim the ceramic bond diamond grinding tools , and the resin grinding tools need to be trimmed once in a while; (4) the grinding accuracy is higher than that of resin grinding wheel due to the good shape stability of ceramic grinding wheel.
Ceramic polishing pad, developed and produced by DTS Diamond tools, specially designed for polishing concrete floors, cutting very aggressive and achieves good finishing, it is a great transitional tool in the market.